TU Delft outlined its SOFT-PACK research project on October 9, 2026. The team is investigating how 3D printing could connect electronic chips directly with soft materials for future implant technologies.
Printing the connection
Led by Achilleas Savva with Dutch company Photosynthetic, the project targets very small structures, down to 5 micrometers. Its approach includes conductive polymers such as PEDOT:PSS, which could form flexible electrodes and connections on chips.
The ambition is to simplify assembly and reduce the mismatch between rigid electronics and soft tissue. TU Delft reports almost €1 million in TKI funding for the work.
Why it matters
Our takeaway: this is an example of additive manufacturing creating functional connections, beyond simply making an object's outer shape. Material behavior becomes part of the design.
The announcement describes a research program and potential future applications. It does not establish a finished implant or proven patient benefit.
Read TU Delft's October 9 announcement.
Featured image: AI-generated concept illustration; it does not depict the team's actual device.